Samsung’s started foundries rolling for its new embedded multi-chip package memory for budget smartphones — after the success of the high-end modules that were released in October. eMCP jams together 30-nanometer low-power DDR2 DRAM and 20-nanometer NAND flash memory into a single slice of silicon. In real terms, this means that there’s a 4GB e-MMC (embedded MultiMediaCard) flash chip with a 256MB, 512MB or 768MB DDR2 DRAM module bolted on the side. According to the company, it’ll consume 25 percent less power with 30 percent better performance, cost less to jam into your telephone and probably make you smell better, too. If you’re starting your own phone company, or just curious about embedded systems, head past the break for the PR.